Plasma-Therm - PlasmaPOD™ - Sputter Deposition
Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.
To-date, Advanced Vacuum have four broad preconfigured toolsets available;
- Reactive Ion Etch (RIE)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Sputter Deposition (4 variations)
- Barrel Etch (2 variations)
This listing is for the PlasmaPOD™ Sputter Deposition, which is available as a 300W RF Generator with auto-matching. Addition features include:
- Stainless Steel chamber with internal shields
- 160mm electrode with rotation (optional water cooling)
- 2 gas lines (inc. MFCs)
- 3 configurations of Magnetrons plus fittings are available
- Internal PLC control system
- Touch-screen interface
- Automatic closed-loop pressure control
- Close-coupled Turbo (requires backing pump)
- All control within the frame to minimize the footprint
- Built-in process recipe control and data logging
Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.
To-date, Advanced Vacuum have four broad preconfigured toolsets available;
- Reactive Ion Etch (RIE)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Sputter Deposition (4 variations)
- Barrel Etch (2 variations)
This listing is for the PlasmaPOD™ Sputter Deposition, which is available as a 300W RF Generator with auto-matching. Addition features include:
- Stainless Steel chamber with internal shields
- 160mm electrode with rotation (optional water cooling)
- 2 gas lines (inc. MFCs)
- 3 configurations of Magnetrons plus fittings are available
- Internal PLC control system
- Touch-screen interface
- Automatic closed-loop pressure control
- Close-coupled Turbo (requires backing pump)
- All control within the frame to minimize the footprint
- Built-in process recipe control and data logging
Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.
To-date, Advanced Vacuum have four broad preconfigured toolsets available;
- Reactive Ion Etch (RIE)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Sputter Deposition (4 variations)
- Barrel Etch (2 variations)
This listing is for the PlasmaPOD™ Sputter Deposition, which is available as a 300W RF Generator with auto-matching. Addition features include:
- Stainless Steel chamber with internal shields
- 160mm electrode with rotation (optional water cooling)
- 2 gas lines (inc. MFCs)
- 3 configurations of Magnetrons plus fittings are available
- Internal PLC control system
- Touch-screen interface
- Automatic closed-loop pressure control
- Close-coupled Turbo (requires backing pump)
- All control within the frame to minimize the footprint
- Built-in process recipe control and data logging
This equipment is advertised on behalf of Plasma-Therm LLC