Corial - 210RL Reactive Ion Etching (RIE) Etch System
Anisotropic RIE etching supported by a wide range of processes.
The Corial 210RL offers a flexible solution for reactive ion etching of wafer pieces, of up to full 200mm wafers. Designed with a vacuum load-lock, the Corial 210RL provides RIE capabilities over a variety of materials including silicon, silicon compounds, polymers, III-V and II-VI compound semiconductors, and metals.
Likewise, Corial's extensive process library for the 210RL etcher supports a wide range of materials. It uses fluorinated reactive gases for Si, SiO2, Si3N4, Ge, W, Ta, TaN, Ti, TiN, TiW, Nb, NbN, Mo and polymer etching. To structure materials such as GaN, AlGaN, GaAs, InP and metals as Al, Cr, Ti, this RIE etcher uses CH4/H2 and chlorinated reactive gases.
Accordingly, with a small footprint and modular design approach supporting tiered upgrades, this etch tool is ideal for R&D centres.
Anisotropic RIE etching supported by a wide range of processes.
The Corial 210RL offers a flexible solution for reactive ion etching of wafer pieces, of up to full 200mm wafers. Designed with a vacuum load-lock, the Corial 210RL provides RIE capabilities over a variety of materials including silicon, silicon compounds, polymers, III-V and II-VI compound semiconductors, and metals.
Likewise, Corial's extensive process library for the 210RL etcher supports a wide range of materials. It uses fluorinated reactive gases for Si, SiO2, Si3N4, Ge, W, Ta, TaN, Ti, TiN, TiW, Nb, NbN, Mo and polymer etching. To structure materials such as GaN, AlGaN, GaAs, InP and metals as Al, Cr, Ti, this RIE etcher uses CH4/H2 and chlorinated reactive gases.
Accordingly, with a small footprint and modular design approach supporting tiered upgrades, this etch tool is ideal for R&D centres.
Anisotropic RIE etching supported by a wide range of processes.
The Corial 210RL offers a flexible solution for reactive ion etching of wafer pieces, of up to full 200mm wafers. Designed with a vacuum load-lock, the Corial 210RL provides RIE capabilities over a variety of materials including silicon, silicon compounds, polymers, III-V and II-VI compound semiconductors, and metals.
Likewise, Corial's extensive process library for the 210RL etcher supports a wide range of materials. It uses fluorinated reactive gases for Si, SiO2, Si3N4, Ge, W, Ta, TaN, Ti, TiN, TiW, Nb, NbN, Mo and polymer etching. To structure materials such as GaN, AlGaN, GaAs, InP and metals as Al, Cr, Ti, this RIE etcher uses CH4/H2 and chlorinated reactive gases.
Accordingly, with a small footprint and modular design approach supporting tiered upgrades, this etch tool is ideal for R&D centres.
This equipment is advertised on behalf of Corial